Evolution of structure and fabrication of Cu/Fe multilayered composites by a repeated diffusion-rolling procedure

• Published in: Materials & design 2015-11, Vol.85, p.635-639
• Main Authors: Yang, Yihang, Wang, Dezhi, Lin, Jia, Khan, Dil Faraz, Lin, Gaoyong, Ma, Jidong
• Format: Article
• Language: English
• Subjects: BONDING; Copper; DEFORMATION; DIFFUSION; DIFFUSION BONDING; Evolution; FABRICATION; INTERLAYERS; Laminates; Plastic deformation; Scanning transmission electron microscopy; SOLVENTS; TRANSMISSION ELECTRON MICROSCOPY
• ISSN: 0264-1275
• DOI: 10.1016/j.matdes.2015.07.082

Cu/Fe multilayered laminated composite was fabricated by a repeated diffusion-rolling procedure. With diffusion bonding initially, thinner layer was fabricated by rolling, and this procedure was repeated. The evolution of structure and properties of Cu/Fe multilayered composite was investigated. The low inter-solubility interface was examined by using high angle annular dark field (HAADF) imaging mode in scanning transmission electron microscopy (STEM). The interfacial strength of Cu/Fe was enhanced by the plastic deformation after rolling. Parallelism of interfaces can almost be achieved when the thickness of layer is above 25 mu m or total reduction ratio is lesser than 99%. An inter diffusion area with about 25nm in width was present at the interface. HR-TEM and FFT investigations at the interface region revealed that disordered substitutional solid solution of Cu and Fe occurred during the procedure.