Energy-Aware Signal Integrity Analysis for High-Speed PCB Links

This paper proposes a novel approach to evaluate design alternatives for high-speed links on printed circuit boards. The approach combines evaluations of signal integrity and link input power. For a comprehensive analysis, different link designs are made comparable through the application of identic...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2015-10, Vol.57 (5), p.1226-1234
Main Authors: Muller, Sebastian, Reuschel, Torsten, Rimolo-Donadio, Renato, Kwark, Young H., Bruns, Heinz-Dietrich, Schuster, Christian
Format: Article
Language:English
Subjects:
Circuit boards
Crosstalk
Decisions
Design engineering
Electromagnetic compatibility
Energy-aware analysis
High speed
high-speed links
Impedance
Integrated circuit interconnections
Links
Printed circuit boards
printed circuit boards (PCBs)
Printed circuits
Scattering parameters
Signal integrity
signal integrity (SI)
Silicon
via arrays
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:This paper proposes a novel approach to evaluate design alternatives for high-speed links on printed circuit boards. The approach combines evaluations of signal integrity and link input power. For a comprehensive analysis, different link designs are made comparable through the application of identical constraints, with the link input power as the single figure of merit for a systematic, quantitative comparison of design alternatives. The analysis relies upon a combination of efficient physics-based via and trace models, statistical time-domain simulation, and an analytical input power evaluation, which allows it to handle links consisting of a large number of channels while fully taking into account interchannel crosstalk. The proposed approach is applied to study two fundamental design decisions at the PCB level-single-ended versus differential signaling and signal-to-ground via ratios of 1:1 versus 2:1-for a link consisting of 2048 vias and up to 175 striplines with an aggregate data rate of 1 Tb/s. It is found that both design decisions have a considerable impact on the required input power of the link.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2015.2427362