An apparatus for performing microtensile tests at elevated temperatures inside a scanning electron microscope

In this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250μm with a displacement resolution of 10nm and a load resolution of 9.7μN. Measurements at elevated temperatures are performed throug...

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Bibliographic Details
Published in:Acta materialia 2013-11, Vol.61 (19), p.7500-7510
Main Authors: Sim, Gi-Dong, Park, Jun-Hyub, Uchic, Michael D., Shade, Paul A., Lee, Soon-Bok, Vlassak, Joost J.
Format: Article
Language:English
Subjects:
Creep
Dislocation mobility
Gages
Grain boundary sliding
Heaters
Heating equipment
High temperature
High-temperature deformation
In situ tension test
Scanning electron microscopy
Slopes
Thin film
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Summary:In this paper, we introduce an apparatus to perform microtensile tests at elevated temperatures inside a scanning electron microscope. The apparatus has a stroke of 250μm with a displacement resolution of 10nm and a load resolution of 9.7μN. Measurements at elevated temperatures are performed through use of two silicon-based micromachined heaters that support the sample. Each heater consists of a tungsten heating element that also serves as a temperature gauge. To demonstrate the testing capabilities, tensile tests were performed on submicron Cu films at various temperatures up to 430°C. Stress–strain curves show a significant decrease in yield strength and initial slope for the samples tested at elevated temperature, which we attribute to diffusion-facilitated grain boundary sliding and dislocation climb.
ISSN:1359-6454
1873-2453
DOI:10.1016/j.actamat.2013.08.064