Characterisation of tin-copper intermetallic growth in electrodeposited tin coatings using electrochemical oxidation techniques

In the present investigations electrochemical oxidation has allowed for the removal of tin from coated copper substrates permitting scanning electron microscopy to be employed to assess intermetallic compound distribution and morphology. It was shown that the initial growth of intermetallic compound...

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Bibliographic Details
Published in:Transactions of the Institute of Metal Finishing 2014-09, Vol.92 (5), p.272-281
Main Authors: Stuttle, C. J., Ashworth, M. A., Wilcox, G. D., Mortimer, R. J.
Format: Article
Language:English
Subjects:
COATINGS
Copper
COPPER COMPOUNDS
Electrochemical oxidation
ELECTRODEPOSITION
ELECTRODES
Grain structure
Intermetallic compound
Intermetallic compounds
Intermetallics
MICA
OXIDATION
Tin
TIN COATINGS
Tin electroplate
Tin whisker
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Summary:In the present investigations electrochemical oxidation has allowed for the removal of tin from coated copper substrates permitting scanning electron microscopy to be employed to assess intermetallic compound distribution and morphology. It was shown that the initial growth of intermetallic compound was not uniform, with its distribution dependent upon the grain structure of the copper substrate, and the grain orientation and distribution within the tin coating. After a period of further nucleation and coarsening, the intermetallic compound forms an almost complete layer along the interface. It is thought this uniform layer of intermetallic compound, formed soon after deposition, may be responsible for this specific electrodeposited tin system having a low whiskering propensity.
ISSN:0020-2967
1745-9192
DOI:10.1179/0020296714Z.000000000174