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Technology for III-N heterogeneous mixed-signal electronics
III‐N devices are suitable for high power RF/microwave amplifier, high temperature electronics, and power switches applications, and the peripheral mixed‐signal electronics with sensing, protection, and control functions could provide optimized performance, increased functionality, and enhanced reli...
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Published in: | Physica status solidi. A, Applications and materials science Applications and materials science, 2014-04, Vol.211 (4), p.769-774 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | III‐N devices are suitable for high power RF/microwave amplifier, high temperature electronics, and power switches applications, and the peripheral mixed‐signal electronics with sensing, protection, and control functions could provide optimized performance, increased functionality, and enhanced reliability. This paper addresses the technology to discuss the technology options of implementing III‐N mixed‐signal circuits, and then reviews the recent progress in the expansion of design library, based on monolithically integrated enhancement/depletion (E/D)‐mode AlGaN/GaN HEMTs on GaN‐on‐silicon substrates.
An integrated GaN proportional‐to‐absolute‐temperature (PTAT) voltage source.
Peripheral mixed‐signal circuits with sensing, protection and control functions could provide optimized performance, increased functionality and enhanced reliability to III‐N electronic applications such as high‐frequency power amplifiers, power converters and high‐temperature electronics. In this paper, the device technologies for implementing III‐N mixed‐signal integrated circuits (IC) are discussed, and the latest III‐N mixed‐signal IC prototypes are presented. The figure shows a GaN proportional‐to‐absolute‐temperature (PTAT) voltage source. |
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ISSN: | 1862-6300 1862-6319 |
DOI: | 10.1002/pssa.201300543 |