Fabrication of ion-sliced lithium niobate slabs using helium ion implantation and Cu-Sn bonding

The fabrication of LiNbO3 waveguide slabs with sub‐micron thickness is presented using He ion‐induced splitting and the Cu–Sn bonding technique. The exfoliation time of implanted LiNbO3 was investigated as a function of annealing temperatures to reveal the activation energies during the splitting pr...

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Published in:Physica status solidi. A, Applications and materials science Applications and materials science, 2014-10, Vol.211 (10), p.2416-2420
Main Authors: Xiang, Bing-Xi, Guan, Jing, Jiao, Yang, Wang, Lei
Format: Article
Language:English
Subjects:
Annealing
Backscattering
Bonding
Copper
crystal ion slicing
Helium
lithium niobate
Slabs
Splitting
thin films
wafer bonding
Waveguides
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description The fabrication of LiNbO3 waveguide slabs with sub‐micron thickness is presented using He ion‐induced splitting and the Cu–Sn bonding technique. The exfoliation time of implanted LiNbO3 was investigated as a function of annealing temperatures to reveal the activation energies during the splitting process. Defect‐free waveguide films with large areas of several cm2 are consistently produced by using the inter‐diffusion bonding of Cu–Sn interface. The fabricated film was investigated by using the Rutherford backscattering/channeling method and dark mode spectroscopy.
doi_str_mv 10.1002/pssa.201431138
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subjects Annealing
Backscattering
Bonding
Copper
crystal ion slicing
Helium
lithium niobate
Slabs
Splitting
thin films
wafer bonding
Waveguides
title Fabrication of ion-sliced lithium niobate slabs using helium ion implantation and Cu-Sn bonding
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