Low temperature adhesive wafer bonding using OSTE(+) for heterogeneous 3D MEMS integration

We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cu...

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Bibliographic Details
Main Authors: Forsberg, F., Saharil, F., Stemme, G., Roxhed, N., van der Wijngaart, W., Haraldsson, T., Niklaus, F.
Format: Conference Proceeding
Language:English
Subjects:
Adhesive bonding
Bond energy
Bonding
Conferences
Cures
Curing
Glass
Heterogeneous integration
Mechanical systems
OSTE(+)
Plasma temperature
Polymers
Silicon
SRA - ICT
SRA - Informations- och kommunikationsteknik
Three dimensional
Wafer bonding
Wafers
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Summary:We demonstrate, for the first time, the use of off stoichiometry thiolene-epoxy, OSTE(+) for adhesive wafer bonding. The dual cure system, with an initial UV-curing step followed by a second thermal cure, allows for high bond strength and potentially high quality material interfaces. We show that cured OSTE(+) is easily removed in oxygen plasma and that the characteristics of OSTE(+) make it a potential candidate for use in heterogeneous 3D MEMS integration. Furthermore, we show how the bond energies of wafers bonded with OSTE(+) adhesive compares with the bond energies of wafers bonded with Cyclotene 3022-46 (BCB) and mr-I 9150XP nanoimprint resist.
ISSN:1084-6999
DOI:10.1109/MEMSYS.2013.6474248