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New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study
Three types of interfacial nanostructure are identified in as-bonded Cu–Al bonds: (1) Cu/~5nm amorphous alumina layer/Al; (2) Cu/~20nm CuAl2 intermetallic particle/Al; and (3) Cu/Al. During annealing, in the areas of latter two types where alumina layer is fragmented, Cu9Al4 and CuAl form as second...
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| Published in: | Scripta materialia 2016-04, Vol.115, p.1-5 |
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| Main Authors: | , , , , |
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| Language: | English |
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| cites | cdi_FETCH-LOGICAL-c351t-9d98655f65eb8cc6d7eb5e1d72c6d606419be2aab78c06b69cb52ac5d3f49b1a3 |
| container_end_page | 5 |
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| container_title | Scripta materialia |
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| creator | Xu, Hui Qin, Ivy Clauberg, Horst Chylak, Bob Acoff, Viola L. |
| description | Three types of interfacial nanostructure are identified in as-bonded Cu–Al bonds: (1) Cu/~5nm amorphous alumina layer/Al; (2) Cu/~20nm CuAl2 intermetallic particle/Al; and (3) Cu/Al. During annealing, in the areas of latter two types where alumina layer is fragmented, Cu9Al4 and CuAl form as second and third intermetallic layers, and grow vertically and fast together with initial CuAl2. In the area of first type where alumina layer is present, CuAl2 grows laterally and slowly via Cu diffusion through intermetallic compounds in the neighboring area where alumina is broken to reach Al. Cu–Al interdiffusion is dominated by Cu diffusion.
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| doi_str_mv | 10.1016/j.scriptamat.2015.12.025 |
| format | article |
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[Display omitted]</description><subject>Aluminum</subject><subject>ALUMINUM OXIDE</subject><subject>ANNEALING PROCESSES</subject><subject>BONDS</subject><subject>Copper</subject><subject>Copper–aluminum</subject><subject>DIFFUSION</subject><subject>Diffusion layers</subject><subject>Diffusion rate</subject><subject>In-situ TEM</subject><subject>INTERFACES</subject><subject>Interfacial structure</subject><subject>Intermetallic compounds</subject><subject>Intermetallics</subject><subject>MICROSTRUCTURES</subject><subject>Nanostructure</subject><subject>WIRE</subject><subject>Wire bond</subject><issn>1359-6462</issn><issn>1872-8456</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNqFkE1OwzAUhCMEEqVwBy_ZJNhO7CTLUpUfqcCmrC3beaGu0rjYTlF33IEbchJcCmLJ6o30ZkaaL0kQwRnBhF-tMq-d2QS5liGjmLCM0AxTdpSMSFXStCoYP446Z3XKC05PkzPvVxhjTigZJf4R3pBVHtxWBmN7ZFvUy956LTtApg_gWqmN7BBsbTd8W0yP1kY7i6bD5_vHpENvxgFStm88Urv4Tr0JA1qalyVy4H9ji9kD8mFodufJSSs7Dxc_d5w838wW07t0_nR7P53MU50zEtK6qSvOWMsZqEpr3pSgGJCmpFFzzAtSK6BSqrLSmCtea8Wo1KzJ26JWRObj5PLQu3H2dQAfxNp4DV0ne7CDF6Ssc8oYr6torQ7WOMt7B63YOLOWbicIFnvOYiX-OIs9Z0GoiJxj9PoQhThla8BFo4FeQxOp6CAaa_4v-QKJ2I98</recordid><startdate>20160401</startdate><enddate>20160401</enddate><creator>Xu, Hui</creator><creator>Qin, Ivy</creator><creator>Clauberg, Horst</creator><creator>Chylak, Bob</creator><creator>Acoff, Viola L.</creator><general>Elsevier Ltd</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20160401</creationdate><title>New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study</title><author>Xu, Hui ; Qin, Ivy ; Clauberg, Horst ; Chylak, Bob ; Acoff, Viola L.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c351t-9d98655f65eb8cc6d7eb5e1d72c6d606419be2aab78c06b69cb52ac5d3f49b1a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Aluminum</topic><topic>ALUMINUM OXIDE</topic><topic>ANNEALING PROCESSES</topic><topic>BONDS</topic><topic>Copper</topic><topic>Copper–aluminum</topic><topic>DIFFUSION</topic><topic>Diffusion layers</topic><topic>Diffusion rate</topic><topic>In-situ TEM</topic><topic>INTERFACES</topic><topic>Interfacial structure</topic><topic>Intermetallic compounds</topic><topic>Intermetallics</topic><topic>MICROSTRUCTURES</topic><topic>Nanostructure</topic><topic>WIRE</topic><topic>Wire bond</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xu, Hui</creatorcontrib><creatorcontrib>Qin, Ivy</creatorcontrib><creatorcontrib>Clauberg, Horst</creatorcontrib><creatorcontrib>Chylak, Bob</creatorcontrib><creatorcontrib>Acoff, Viola L.</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Scripta materialia</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Xu, Hui</au><au>Qin, Ivy</au><au>Clauberg, Horst</au><au>Chylak, Bob</au><au>Acoff, Viola L.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study</atitle><jtitle>Scripta materialia</jtitle><date>2016-04-01</date><risdate>2016</risdate><volume>115</volume><spage>1</spage><epage>5</epage><pages>1-5</pages><issn>1359-6462</issn><eissn>1872-8456</eissn><abstract>Three types of interfacial nanostructure are identified in as-bonded Cu–Al bonds: (1) Cu/~5nm amorphous alumina layer/Al; (2) Cu/~20nm CuAl2 intermetallic particle/Al; and (3) Cu/Al. During annealing, in the areas of latter two types where alumina layer is fragmented, Cu9Al4 and CuAl form as second and third intermetallic layers, and grow vertically and fast together with initial CuAl2. In the area of first type where alumina layer is present, CuAl2 grows laterally and slowly via Cu diffusion through intermetallic compounds in the neighboring area where alumina is broken to reach Al. Cu–Al interdiffusion is dominated by Cu diffusion.
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| ispartof | Scripta materialia, 2016-04, Vol.115, p.1-5 |
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| source | ScienceDirect Freedom Collection |
| subjects | Aluminum ALUMINUM OXIDE ANNEALING PROCESSES BONDS Copper Copper–aluminum DIFFUSION Diffusion layers Diffusion rate In-situ TEM INTERFACES Interfacial structure Intermetallic compounds Intermetallics MICROSTRUCTURES Nanostructure WIRE Wire bond |
| title | New observation of nanoscale interfacial evolution in micro Cu–Al wire bonds by in-situ high resolution TEM study |
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