Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package design

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly...

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Bibliographic Details
Published in:Journal of materials science. Materials in electronics 2016-03, Vol.27 (3), p.2430-2441
Main Authors: Suhir, E., Ghaffarian, R., Nicolics, J.
Format: Article
Language:English
Subjects:
Assemblies
Characterization and Evaluation of Materials
Chemistry and Materials Science
Columns (structural)
Design analysis
Design engineering
Devices
Materials Science
Optical and Electronic Materials
Solders
Stresses
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Summary:There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.
ISSN:0957-4522
1573-482X
DOI:10.1007/s10854-015-4042-8