Development of New Photosensitive Low CTE Materials

We developed a new negative type photosensitive material with the phenolic resin. The film of the material cured at 260oC showed low coefficients of thermal expansion (CTE), low residual stress and good heat resistance. And the material exhibited good lithography performance. Thus, we expect applica...

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Bibliographic Details
Published in:Journal of Photopolymer Science and Technology 2015/05/11, Vol.28(3), pp.407-410
Main Authors: Doi, Takashi, Uno, Takaaki, Nishimura, Isao, Hayashi, Eiji
Format: Article
Language:English
Subjects:
Curing
Lithography
low CTE
low residual stress
Negative type photosensitive material
Packaging
Photopolymers
Photosensitivity
Residual stress
Thermal resistance
Three dimensional
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Summary:We developed a new negative type photosensitive material with the phenolic resin. The film of the material cured at 260oC showed low coefficients of thermal expansion (CTE), low residual stress and good heat resistance. And the material exhibited good lithography performance. Thus, we expect application of this material to 3D packaging which requires low CTE and low residual stress by low temperature curing.
ISSN:0914-9244
1349-6336
DOI:10.2494/photopolymer.28.407