High-Efficiency Micromachined Sub-THz Channels for Low-Cost Interconnect for Planar Integrated Circuits

This paper presents for the first time the design, fabrication, and demonstration of a micromachined silicon dielectric waveguide based sub-THz interconnect channel for a high-efficiency, low-cost sub-THz interconnect, aiming to solve the long-standing intrachip/interchip interconnect problem. Caref...

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Bibliographic Details
Published in:IEEE transactions on microwave theory and techniques 2016-01, Vol.64 (1), p.96-105
Main Authors: Bo Yu, Yuhao Liu, Yu Ye, Junyan Ren, Xiaoguang Liu, Gu, Qun Jane
Format: Article
Language:English
Subjects:
Bandwidth
Channel
Channels
Design optimization
dielectric waveguide
Dielectric waveguides
Dielectrics
Integrated circuit interconnections
interconnect
Interconnections
micromachined
Micromachining
Micromechanics
Microwaves
Optical waveguides
Propagation losses
Silicon
sub-THz
terahertz (THz)
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Summary:This paper presents for the first time the design, fabrication, and demonstration of a micromachined silicon dielectric waveguide based sub-THz interconnect channel for a high-efficiency, low-cost sub-THz interconnect, aiming to solve the long-standing intrachip/interchip interconnect problem. Careful studies of the loss mechanisms in the proposed sub-THz interconnect channel are carried out to optimize the design. Both theoretical and experimental results are provided with good agreement. To guide the channel design, a new figure of merit is also defined. The insertion loss of this first prototype with a 6-mm-long interconnect channel is about 8.4 dB at 209.7 GHz, with a 3-dB bandwidth of 12.6 GHz.
ISSN:0018-9480
1557-9670
DOI:10.1109/TMTT.2015.2504443