New challenges and opportunities for 3D integrations

From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics,...

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Main Authors: Michailos, J., Coudrain, P., Farcy, A., Hotellier, N., Cheramy, S., Lhostis, S., Deloffre, E., Sanchez, Y., Jouve, A., Guyader, F., Saugier, E., Fiori, V., Vivet, P., Vinet, M., Fenouillet-Beranger, C., Casset, F., Batude, P., Breuf, F., Henrion, Y., Vianne, B., Collin, L.-M, Colonna, J.-P, Benaissa, L., Brunet, L., Prieto, R., Velard, R., Ponthenier, F.
Format: Conference Proceeding
Language:English
Subjects:
Bonding
Density
Devices
Integrated circuit interconnections
Meetings
Performance assessment
Platforms
Silicon
Stacking
Stress
Temperature measurement
Three dimensional
Three-dimensional displays
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Summary:From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.
ISSN:2156-017X
DOI:10.1109/IEDM.2015.7409655