Enhanced thermoelectric properties of Cu sub(1.8)Se sub(1-x)S sub(x) alloys prepared by mechanical alloying and spark plasma sintering

Cu sub(1.8)Se sub(1-x)S sub(x) (0 less than or equal to x less than or equal to 1) thermoelectric alloys were prepared by mechanical alloying (MA) combined with spark plasma sintering (SPS) technology. The phase structure and morphologies of all the samples were characterized by X-ray diffraction (X...

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Bibliographic Details
Published in:Journal of alloys and compounds 2016-09, Vol.680, p.273-277
Main Authors: Ji, Yi-Hong, Ge, Zhen-Hua, Li, Zhidong, Feng, Jing
Format: Article
Language:English
Subjects:
Copper base alloys
Doping
Field emission
Mechanical alloying
Spark plasma sintering
Thermal conductivity
Thermoelectricity
Transport properties
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Summary:Cu sub(1.8)Se sub(1-x)S sub(x) (0 less than or equal to x less than or equal to 1) thermoelectric alloys were prepared by mechanical alloying (MA) combined with spark plasma sintering (SPS) technology. The phase structure and morphologies of all the samples were characterized by X-ray diffraction (XRD) and field emission scanning electron microscopy (FESEM). The electrical conductivity, Seebeck coefficient, thermal conductivity were investigated for all the Cu sub(1.8)Se sub(1-x)S sub(x) alloys with a special emphasis on the influence of the S doping. With the increasing of S contents, a phase transition of Cu sub(1.8)Se sub(1-x)S sub(x) was occurred from cubic to hexagonal. The electrical and thermal transport properties of the samples changed accordingly. The Cu sub(1.8)Se sub(0.7)S sub(0.3) alloy achieves the highest ZT of 0.78 at 773 K due to both optimized electrical transport properties and thermal transport properties, which is 44% higher than that of pristine Cu sub(1.8)S (0.54 at 773 K) and 95% higher than that of pristine Cu sub(1.8)Se (0.4 at 773 K).
ISSN:0925-8388
DOI:10.1016/j.jallcom.2016.04.140