Surface-Passive Pressure Sensor by Femtosecond Laser Glass Structuring for Flip-Chip-in-Foil Integration

• Published in: Journal of microelectromechanical systems 2016-06, Vol.25 (3), p.517-523
• Main Authors: Schwerter, Martin, Grabner, Daniel, Hecht, Lars, Vierheller, Anke, Leester-Schadel, Monika, Dietzel, Andreas
• Format: Article
• Language: English
• Subjects: Adhesive bonding; Bonding; Chambers; Detection; Femtosecond; femtosecond laser structuring; flexible systems; flip-chip; Glass; Harsh environment pressure sensor; Membranes; Piezoresistive devices; Pressure sensors; Sensors; Silicon; Stress
• ISSN: 1057-7157; 1941-0158
• DOI: 10.1109/JMEMS.2016.2539202

To allow for smaller sizes, smoothness and robustness of exposed surface, and for integration in flexible sensor arrays, an innovative piezoresistive pressure sensor design has been developed. In contrast to known concepts, the sensing elements and the conducting tracks are positioned within the pressure reference chamber and, thus, protected against environmental influences such as water or particles. Sensing elements are electrically accessible from the backside by vias, thus enabling a fully flat surface totally free of electrical elements as desired for flow experiments. The sensor comprises a thin silicon sensing membrane and a body made from glass holding the reference chamber and the vias. The structuring of the sensor body is performed by femtosecond laser ablation. Steep ablation edges are realized, leading to small sensor dimensions. The sensing membrane is fabricated using potassium hydroxide (KOH) wet etching. The glass body and the silicon membrane can be connected with different techniques; hitherto, adhesive bonding by an epoxy resin layer was successfully tested. A sensitivity of 10 mV/V/bar and stable operation up to 7 bar absolute pressure could already be demonstrated. The new concept simplifies micromanufacture and allows for flip-chip-assembly in foil-based flexible systems that can be used in liquids and harsh environments.