Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications

A comparative study of Sn–3.0Ag–0.5Cu (SAC305) and Au–20Sn solders as die‐attach materials for high‐temperature power electronic applications was performed. The solid‐state interfacial reactions of SAC305 and Au–20Sn solders with a Ni‐plated Si chip and a direct‐bonded‐copper substrate, as well as t...

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Bibliographic Details
Published in:Surface and interface analysis 2016-07, Vol.48 (7), p.493-497
Main Authors: Lee, Byung-Suk, Lee, Chang-Woo, Yoon, Jeong-Won
Format: Article
Language:English
Subjects:
Au-20Sn solder
Electronics
Gold base alloys
Interface reactions
interfacial reaction
intermetallic compound (IMC)
Intermetallic compounds
Intermetallics
power electronics
Silicon substrates
Sn-3.0Ag-0.5Cu solder
Solders
Stability
Tin
Tin base alloys
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Summary:A comparative study of Sn–3.0Ag–0.5Cu (SAC305) and Au–20Sn solders as die‐attach materials for high‐temperature power electronic applications was performed. The solid‐state interfacial reactions of SAC305 and Au–20Sn solders with a Ni‐plated Si chip and a direct‐bonded‐copper substrate, as well as the growth of interfacial intermetallic compound layers and interfacial stability, were investigated and compared during aging at 150 and 200 °C for up to 2000 h. The SAC305 solder exhibited a higher interfacial intermetallic compound growth rate and a higher consumption rate of the Ni layer than the Au–20Sn solder. The Au–20Sn solder had a superior interfacial stability for high‐temperature power electronic applications. Copyright © 2016 John Wiley & Sons, Ltd.
ISSN:0142-2421
1096-9918
DOI:10.1002/sia.5998