Large reduction in thermal conductivity for SiGe alloy nanowire wrapped with a Ge nanoparticle-embedded SiO sub(2) shell

We demonstrate silicon germanium (SiGe) alloy nanowires (NWs) with Ge nanoparticles (GeNPs) embedded in a SiO sub(2) shell as a material for decreasing thermal conductivity. During thermal oxidation of SiGe NWs to form SiGe-SiO sub(2) core-shell structures, Ge atoms were diffused into the SiO sub(2)...

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Bibliographic Details
Published in:Nanotechnology 2016-07, Vol.27 (30), p.305703-305707
Main Authors: Lee, Jong Woon, Lee, Junho, Jung, Su-Ho, Jang, Yamujin, Choi, Byoung Lyong, Yang, Cheol-Woong, Whang, Dongmok, Lee, Eun Kyung
Format: Article
Language:English
Subjects:
Diffusion
Germanium
Heat transfer
Nanostructure
Reduction
Silicon dioxide
Silicon germanides
Thermal conductivity
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Summary:We demonstrate silicon germanium (SiGe) alloy nanowires (NWs) with Ge nanoparticles (GeNPs) embedded in a SiO sub(2) shell as a material for decreasing thermal conductivity. During thermal oxidation of SiGe NWs to form SiGe-SiO sub(2) core-shell structures, Ge atoms were diffused into the SiO sub(2) shell to relax the strain in the SiGe core, and agglomerated as a few nanometer-sized particles. This structure leads to a large reduction in thermal conductivity due to the GeNP-phonon interaction, while electrical conductivity is sustained because the core of the SiGe alloy NW provides a current path for the charged carriers. The thermal conductivity of the SiGe alloy NWs wrapped with a GeNP-embedded SiO sub(2) shell is 0.41 W m super(-1) K super(-1) at 300 K.
ISSN:0957-4484
1361-6528
DOI:10.1088/0957-4484/27/30/305703