Platinum Thin-Film Electrodes Prepared by a Cost-Effective Chemical Vapor Deposition Technique

Thin‐film growth of metallic platinum by aerosol‐assisted chemical vapor deposition (AA‐CVD) is an attractive alternative to the application of vacuum‐based methods. This versatile and scalable technique allows gas phase deposition of thin‐films from nebulized precursor solutions in a simple, open s...

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Bibliographic Details
Published in:Advanced engineering materials 2016-07, Vol.18 (7), p.1200-1207
Main Authors: Schlupp, Meike V. F., Wehrle, Moritz M., Kunze, Karsten, Remhof, Arndt, Vogt, Ulrich F.
Format: Article
Language:English
Subjects:
Aerosols
Chemical vapor deposition
Deposition
Microstructure
Platinum
Silicon substrates
Thin films
Yttria stabilized zirconia
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Summary:Thin‐film growth of metallic platinum by aerosol‐assisted chemical vapor deposition (AA‐CVD) is an attractive alternative to the application of vacuum‐based methods. This versatile and scalable technique allows gas phase deposition of thin‐films from nebulized precursor solutions in a simple, open setup at moderate temperatures between 400 and 600°C. We discuss the film growth mechanisms on silicon and zirconia substrates in terms of microstructure, surface coverage, sheet resistance, and thermal stability. Furthermore, the positive influence of Pt thin‐films deposited by AA‐CVD on the area specific resistance (ASR) of symmetric Pt/YSZ/Pt cells in air is presented. Thin‐film growth of metallic platinum by aerosol‐assisted chemical vapor deposition (AA‐CVD) is an attractive alternative to the application of vacuum‐based methods. The authors tune the deposition parameters for Pt thin‐film applications at 600 °C and discuss microstructure, thermal stability, and electrical/electrochemical performance on different substrates (silicon, YSZ).
ISSN:1438-1656
1527-2648
DOI:10.1002/adem.201500636