Prediction of Induced Voltages on Ports in Complex, Three-Dimensional Enclosures With Apertures, Using the Random Coupling Model

A statistical modeling technique known as the random coupling model (RCM) is an effective method for estimating the probabilistic magnitudes of induced voltages on objects within a closed, complex, three-dimensional (3-D) enclosure. The limitations of the RCM to predict electromagnetic wave coupling...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on electromagnetic compatibility 2016-10, Vol.58 (5), p.1535-1540
Main Authors: Gil Gil, Jesus, Drikas, Zachary B., Andreadis, Tim D., Anlage, Steven M.
Format: Article
Language:English
Subjects:
Aperture antennas
Apertures
Cavity resonators
Coupling
Couplings
electromagnetic compatibility
Enclosures
Impedance
Induced voltage
Mathematical models
overmoded enclosures
Ports (Computers)
probability density function (PDF)
Probability theory
random coupling model (RCM)
RCM
statistical electromagnetism
Three dimensional models
Transmission line measurements
Voltage measurement
wave scattering
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:A statistical modeling technique known as the random coupling model (RCM) is an effective method for estimating the probabilistic magnitudes of induced voltages on objects within a closed, complex, three-dimensional (3-D) enclosure. The limitations of the RCM to predict electromagnetic wave coupling into an enclosure with apertures are examined. We experimentally demonstrate the applicability of the RCM to estimate the probabilistic magnitudes of voltages induced on ports in a complex 3-D enclosure with an electrically large aperture. This study is a first step toward being able to predict effects on sensitive electronic targets in large, real-world, lossy enclosures such as office buildings, ship compartments, and aircraft compartments.
ISSN:0018-9375
1558-187X
DOI:10.1109/TEMC.2016.2580301