Experimental Characterization of Crack Growth Behavior in Adhesive Interface under Impact Loading

A novel experimental method has been developed to evaluate the mode I crack growth behavior of adhesively bonded joints under impact loading. The split Hopkinson pressure bar (SHPB) technique and the digital image correlation (DIC) technique was employed to evaluate the crack growth behavior. To red...

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Bibliographic Details
Published in:Key Engineering Materials 2016-09, Vol.715, p.116-121
Main Authors: Ishida, Hisayoshi, Oshima, Sota, Kusaka, Takayuki, Tanegashima, Ryota, Takeda, Tomo
Format: Article
Language:English
Subjects:
Adhesion tests
Adhesive bonding
Adhesive joints
Bonded joints
Cameras
Contact angle
Crack propagation
Engineering
Experimental methods
Fracture mechanics
Fracture toughness
Impact loading
Impact strength
Load
Propagation
Research methodology
Strain gauges
Titanium alloys
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Summary:A novel experimental method has been developed to evaluate the mode I crack growth behavior of adhesively bonded joints under impact loading. The split Hopkinson pressure bar (SHPB) technique and the digital image correlation (DIC) technique was employed to evaluate the crack growth behavior. To reduce the dynamic effects by controlling loading input of the SHPB apparatus, the fracture toughness was determined precisely based on static evaluation formula. To contrive the testing set-up, high loading rate was kept until the arrest of crack. The fracture toughness of titanium alloy/epoxy adhesively bonded joints during crack propagation was obtained successfully by using present method.
ISSN:1013-9826
1662-9795
1662-9795
DOI:10.4028/www.scientific.net/KEM.715.116