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Fabrication of interconnected multilevel channels in a monolithic SU-8 structure using a LOR sacrificial layer
The development of new microfabrication techniques is attracting more and more interest because of the increasing demand for three-dimensional tools with features of biocompatibility, flexibility and low-costs in the lab-on-chip field. Photolithographic techniques involving the molding of organic po...
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Published in: | Microelectronic engineering 2016-10, Vol.164, p.30-35 |
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Main Authors: | , , , , , , |
Format: | Article |
Language: | English |
Subjects: | |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | The development of new microfabrication techniques is attracting more and more interest because of the increasing demand for three-dimensional tools with features of biocompatibility, flexibility and low-costs in the lab-on-chip field. Photolithographic techniques involving the molding of organic polymers, like SU-8, allow for short fabrication times and simplicity in devices prototyping. In this paper we used LOR and SU-8 resists in combination within an innovative lithographic approach. LOR resist was employed not as a typical sacrificial layer for the production of free-standing structures but as a three-dimensional solid resist, which can be patterned and embedded in a SU-8 monolith. After dissolution it can form cavities to provide a final multilevel structure. A detailed description of the optimization process required to obtain the final structure and to overcome issues related to the employ of LOR is reported. In the end, a network of working interconnected multilevel microchannels, useful for biological applications, has been realized through a new, cheap and time-saving method.
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•A process to obtain multilevel microchannels in a monolithic SU8 structure was optimized.•We used LOR and SU8 resists in combination for an innovative lithographic approach.•A tool for biological applications in the lab-on-chip field was realized. |
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ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/j.mee.2016.07.006 |