Integrated microchannel cooling in a three dimensional integrated circuit: A thermal management

Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this...

Full description

Saved in:
Bibliographic Details
Published in:Thermal science 2016-01, Vol.20 (3), p.899-902
Main Authors: Wang, Kang-Jia, Pan, Zhong-Liang
Format: Article
Language:English
Subjects:
Circuit design
Cooling
Guidelines
Integrated circuits
Liquids
Microchannels
Parameters
Temperature profiles
Thermal design
Thermal energy
Thermal management
Thermal properties
Thermodynamic properties
Citations: Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:Microchannel cooling is a promising technology for solving the three-dimensional integrated circuit thermal problems. However, the relationship between the microchannel cooling parameters and thermal behavior of the three dimensional integrated circuit is complex and difficult to understand. In this paper, we perform a detailed evaluation of the influence of the microchannel structure and the parameters of the cooling liquid on steady-state temperature profiles. The results presented in this paper are expected to aid in the development of thermal design guidelines for three dimensional integrated circuit with microchannel cooling.
ISSN:0354-9836
2334-7163
DOI:10.2298/TSCI1603899W