Cooling by Thermodynamic Induction

A method is described for cooling conductive channels to below ambient temperature. The thermodynamic induction principle dictates that the electrically biased channel will cool if the electrical conductance decreases with temperature. The extent of this cooling is calculated in detail for both case...

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Bibliographic Details
Published in:Journal of low temperature physics 2017-03, Vol.186 (5-6), p.316-346
Main Author: Patitsas, S. N.
Format: Article
Language:English
Subjects:
Ambient temperature
Carbon nanotubes
Channels
Characterization and Evaluation of Materials
Circuits
Condensed Matter Physics
Cooling
Graphene
Low temperature physics
Magnetic Materials
Magnetism
Mathematical analysis
Metal-insulator transition
Physics
Physics and Astronomy
Quantum computers
Resistance
Semiconductors
Temperature dependence
Thermodynamics
Thermoelectric cooling
Transport
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Summary:A method is described for cooling conductive channels to below ambient temperature. The thermodynamic induction principle dictates that the electrically biased channel will cool if the electrical conductance decreases with temperature. The extent of this cooling is calculated in detail for both cases of ballistic and conventional transport with specific calculations for carbon nanotubes and conventional metals, followed by discussions for semiconductors, graphene, and metal–insulator transition systems. A theorem is established for ballistic transport stating that net cooling is not possible. For conventional transport, net cooling is possible over a broad temperature range, with the range being size-dependent. A temperature clamping scheme for establishing a metastable nonequilibrium stationary state is detailed and followed with discussion of possible applications to on-chip thermoelectric cooling in integrated circuitry and quantum computer systems.
ISSN:0022-2291
1573-7357
DOI:10.1007/s10909-016-1711-9