A novel Z-directed embedded component for the reduction of voltage ripple on the power distribution network for PCBs

A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in t...

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Bibliographic Details
Published in:IEEE electromagnetic compatibility magazine 2017-01, Vol.6 (3), p.91-97
Main Authors: Biyao Zhao, Hardin, Keith, Hosseinbeig, Ahmad, Cao, Ying S., Dikhaminjia, Nana, Kratzer, Zach, Fessler, John, Drewniak, James
Format: Article
Language:English
Subjects:
Capacitors
Copper plating
Decoupling
Electric power distribution
Embedded systems
equivalent circuit
Impedance
Inductance
Integrated circuits
Networks
PDN noise
Plating
Power distribution network design
Surface impedance
Surface treatment
switch current
voltage ripple
Z-Directed component (ZDC)
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Description
Summary:A new capacitor package and PCB embedding technique is introduced to significantly reduce the system power distribution network impedance at the pads of surface mounted integrated circuits. The capacitor is multi-layer ceramic capacitor (MLCC) that is a right cylindrical shape with via channels in the outer wall along the axis of the part. The capacitor called a Z-Directed component (ZDC) is then pressed into a hole in the PCB. The connections to the component are then made by the copper plating process similar to via hole construction. This new configuration dramatically improves the PDN performance of PCBs with fewer components than the conventional solution with SMD decoupling capacitors.
ISSN:2162-2264
2162-2272
DOI:10.1109/MEMC.0.8093847