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Low temperature growth of gallium oxide thin films via plasma enhanced atomic layer deposition

Herein we describe an efficient low temperature (60-160 °C) plasma enhanced atomic layer deposition (PEALD) process for gallium oxide (Ga O ) thin films using hexakis(dimethylamido)digallium [Ga(NMe ) ] with oxygen (O ) plasma on Si(100). The use of O plasma was found to have a significant improveme...

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Published in:Dalton transactions : an international journal of inorganic chemistry 2017, Vol.46 (47), p.16551-16561
Main Authors: O'Donoghue, Richard, Rechmann, Julian, Aghaee, Morteza, Rogalla, Detlef, Becker, Hans-Werner, Creatore, Mariadriana, Wieck, Andreas Dirk, Devi, Anjana
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cited_by cdi_FETCH-LOGICAL-c381t-4b836536ebc9e9801568a9fa1fa6e7b05888123331cbda2ab9ca21390a273bef3
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container_title Dalton transactions : an international journal of inorganic chemistry
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creator O'Donoghue, Richard
Rechmann, Julian
Aghaee, Morteza
Rogalla, Detlef
Becker, Hans-Werner
Creatore, Mariadriana
Wieck, Andreas Dirk
Devi, Anjana
description Herein we describe an efficient low temperature (60-160 °C) plasma enhanced atomic layer deposition (PEALD) process for gallium oxide (Ga O ) thin films using hexakis(dimethylamido)digallium [Ga(NMe ) ] with oxygen (O ) plasma on Si(100). The use of O plasma was found to have a significant improvement on the growth rate and deposition temperature when compared to former Ga O processes. The process yielded the second highest growth rates (1.5 Å per cycle) in terms of Ga O ALD and the lowest temperature to date for the ALD growth of Ga O and typical ALD characteristics were determined. From in situ quartz crystal microbalance (QCM) studies and ex situ ellipsometry measurements, it was deduced that the process is initially substrate-inhibited. Complementary analytical techniques were employed to investigate the crystallinity (grazing-incidence X-ray diffraction), composition (Rutherford backscattering analysis/nuclear reaction analysis/X-ray photoelectron spectroscopy), morphology (X-ray reflectivity/atomic force microscopy) which revealed the formation of amorphous, homogeneous and nearly stoichiometric Ga O thin films of high purity (carbon and nitrogen
doi_str_mv 10.1039/c7dt03427j
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The use of O plasma was found to have a significant improvement on the growth rate and deposition temperature when compared to former Ga O processes. The process yielded the second highest growth rates (1.5 Å per cycle) in terms of Ga O ALD and the lowest temperature to date for the ALD growth of Ga O and typical ALD characteristics were determined. From in situ quartz crystal microbalance (QCM) studies and ex situ ellipsometry measurements, it was deduced that the process is initially substrate-inhibited. Complementary analytical techniques were employed to investigate the crystallinity (grazing-incidence X-ray diffraction), composition (Rutherford backscattering analysis/nuclear reaction analysis/X-ray photoelectron spectroscopy), morphology (X-ray reflectivity/atomic force microscopy) which revealed the formation of amorphous, homogeneous and nearly stoichiometric Ga O thin films of high purity (carbon and nitrogen &lt;2 at.%) under optimised process conditions. Tauc plots obtained via UV-Vis spectroscopy yielded a band gap of 4.9 eV and the transmittance values were more than 80%. Upon annealing at 1000 °C, the transformation to oxygen rich polycrystalline β-gallium oxide took place, which also resulted in the densification and roughening of the layer, accompanied by a slight reduction in the band gap. 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Tauc plots obtained via UV-Vis spectroscopy yielded a band gap of 4.9 eV and the transmittance values were more than 80%. Upon annealing at 1000 °C, the transformation to oxygen rich polycrystalline β-gallium oxide took place, which also resulted in the densification and roughening of the layer, accompanied by a slight reduction in the band gap. 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Tauc plots obtained via UV-Vis spectroscopy yielded a band gap of 4.9 eV and the transmittance values were more than 80%. Upon annealing at 1000 °C, the transformation to oxygen rich polycrystalline β-gallium oxide took place, which also resulted in the densification and roughening of the layer, accompanied by a slight reduction in the band gap. This work outlines a fast and efficient method for the low temperature ALD growth of Ga O thin films and provides the means to deposit Ga O upon thermally sensitive polymers like polyethylene terephthalate.</abstract><cop>England</cop><pub>Royal Society of Chemistry</pub><pmid>29160880</pmid><doi>10.1039/c7dt03427j</doi><tpages>11</tpages><orcidid>https://orcid.org/0000-0003-2142-8105</orcidid><orcidid>https://orcid.org/0000-0002-5404-2498</orcidid><orcidid>https://orcid.org/0000-0002-9022-6366</orcidid><orcidid>https://orcid.org/0000-0001-9776-2922</orcidid></addata></record>
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subjects Atomic force microscopy
Atomic layer epitaxy
Backscattering
Densification
Ellipsometry
Gallium oxides
Grazing incidence
Low temperature
Plasma
Polyethylene terephthalate
Roughening
Spectrum analysis
Substrate inhibition
Thin films
title Low temperature growth of gallium oxide thin films via plasma enhanced atomic layer deposition
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