Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates

A solid silver-ligand complex, μ-oxolato-bis­(ethylenediaminesilver­(I)), was developed for formulating particle-free conductive metal–organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink fo...

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Bibliographic Details
Published in:ACS applied materials & interfaces 2018-01, Vol.10 (4), p.3830-3837
Main Authors: Zope, Khushbu R, Cormier, Denis, Williams, Scott A
Format: Article
Language:English
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Summary:A solid silver-ligand complex, μ-oxolato-bis­(ethylenediaminesilver­(I)), was developed for formulating particle-free conductive metal–organic decomposition (MOD) inkjet inks. The complex comprises both a high molar silver content and solubility in inkjet compatible polar solvents. An aqueous ink formulation with 29.5 wt % silver content was developed and inkjet printed onto glass, polyethylene terephthalate, and polyimide substrates. A new hybrid thermal-photonic curing approach resulting in substantially improved electrical properties and substrate adhesion is presented. Silver conductive traces were measured to have bulk resistivity of 4.26 × 10–8 Ω m, which is 2.7 times that of bulk silver. One-pot complex synthesis yielded an easily isolated, and stable, solid product that can be formulated when needed thereby improving shelf life.
ISSN:1944-8244
1944-8252
DOI:10.1021/acsami.7b19161