Laser Sintering of Liquid Metal Nanoparticles for Scalable Manufacturing of Soft and Flexible Electronics

• Published in: ACS applied materials & interfaces 2018-08, Vol.10 (33), p.28232-28241
• Main Authors: Liu, Shanliangzi, Yuen, Michelle C, White, Edward L, Boley, J. William, Deng, Biwei, Cheng, Gary J, Kramer-Bottiglio, Rebecca
• Format: Article
• Language: English
• ISSN: 1944-8244; 1944-8252
• DOI: 10.1021/acsami.8b08722

Soft, flexible, and stretchable electronics are needed to transmit power and information, and track dynamic poses in next-generation wearables, soft robots, and biocompatible devices. Liquid metal has emerged as a promising material for these applications due to its high conductivity and liquid phase state at room temperature; however, surface oxidation of liquid metal gives it unique behaviors that are often incompatible with scalable manufacturing techniques. This paper reports a rapid and scalable approach to fabricate soft and flexible electronics composed of liquid metal. Compared to other liquid metal patterning approaches, this approach has the advantages of compatibility with a variety of substrates, ease of scalability, and efficiency through automated processes. Nonconductive liquid metal nanoparticle films are sintered into electrically conductive patterns by use of a focused laser beam to rupture and ablate particle oxide shells, and allow their liquid metal cores to escape and coalesce. The laser sintering phenomenon is investigated through comparison with focused ion beam sintering and by studying the effects of thermal propagation in sintered films. The effects of laser fluence, nanoparticle size, film thickness, and substrate material on resistance of the sintered films are evaluated. Several devices are fabricated to demonstrate the electrical stability of laser-patterned liquid metal traces under flexing, multilayer circuits, and intricately patterned circuits. This work merges the precision, consistency, and speed of laser manufacturing with the material benefits of liquid conductors on elastic substrates to demonstrate decisive progress toward commercial-scale manufacturing of soft electronics.