Low temperature approach for high density electrical feedthroughs for neural implants using maskless fabrication techniques

Implantable electronic packages for neural implants utilize reliable electrical feedthroughs that connect the inside of a sealed capsule to the components that are exposed to the surrounding body tissue. With the ongoing miniaturization of implants requiring ever higher integration densities of such...

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Bibliographic Details
Main Authors: Langenmair, M., Martens, J., Gierthmuehlen, M., Plachta, D. T. T., Stieglitz, T.
Format: Conference Proceeding
Language:English
Subjects:
Gold
Helium
Laser beams
Neural implants
Substrates
Testing
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Summary:Implantable electronic packages for neural implants utilize reliable electrical feedthroughs that connect the inside of a sealed capsule to the components that are exposed to the surrounding body tissue. With the ongoing miniaturization of implants requiring ever higher integration densities of such feedthroughs new technologies have to be investigated. The presented work investigates the sealing of vertical feedthroughs in aluminum-oxide-substrates with gold stud-bumps. The technology enables integration densities of up to 1600/cm 2 while delivering suitable water leak rates for realistic implantation durations of miniaturized packages (feedthrough-count > 50, package-volume
ISSN:1558-4615
2694-0604
DOI:10.1109/EMBC.2018.8512922