Development of oxide diffusion-barrier on refractory metals

A new approach to the development of diffusion-barrier coatings which can effectively reduce the interaction of refractory filaments such as tungsten and tantalum with a nickel-alloy matrix is presented. This consists of reacting the oxide film deliberately grown on these metals with a nickel coatin...

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Published in:Journal of materials science 1974-06, Vol.9 (6), p.1004-1010
Main Authors: Roy, C., Pastein, S.
Format: Article
Language:English
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description A new approach to the development of diffusion-barrier coatings which can effectively reduce the interaction of refractory filaments such as tungsten and tantalum with a nickel-alloy matrix is presented. This consists of reacting the oxide film deliberately grown on these metals with a nickel coating prior to fabricating the composite. The nickel-oxide film reactions proceed under vacuum conditions in the temperature range from 650 to 800 C with the formation of intermediate phases which produce sufficiently strong bonds for composite strengthening. The details of the reaction mechanisms are not known, but two types of reaction are identified. Type 1 constitutes a displacement reaction at the Ni/oxide interface leading to the formation of new phases, while type 2 is controlled by the bulk diffusion of nickel through the compact oxide film with the development of a diffusion zone at the oxide/substrate interface.
doi_str_mv 10.1007/BF00570396
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title Development of oxide diffusion-barrier on refractory metals
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