Lead-free Impact on Wafer Bumping & Wafer-level Packaging

Popular areas for investigation include memory products (e.g., SRAM, DDRAM), wafer-level CSPs including integrated passives and protection devices, and small-die flip chip structures.

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Bibliographic Details
Published in:Advanced packaging 2005-11, Vol.14 (11), p.14
Main Author: Teutsch, Thorsten
Format: Magazinearticle
Language:English
Subjects:
Compliance
Consumer electronics
Free will
Lead
Packaging
Soldering
Technological change
Online Access:Get full text
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Description
Summary:Popular areas for investigation include memory products (e.g., SRAM, DDRAM), wafer-level CSPs including integrated passives and protection devices, and small-die flip chip structures.
ISSN:1065-0555