Low-temperature sintering of silver nanoparticles on paper by surface modification

Ultralow-temperature sintering plays a vital role in the development of flexible printed electronics, which improves flexibility and reduces energy consumption. This study investigates the ultralow-temperature sintering of large-sized silver nanoparticles (Ag NPs) by laser modification of the substr...

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Bibliographic Details
Published in:Nanotechnology 2019-12, Vol.30 (50), p.505303-505303
Main Authors: Zhang, Ling, Feng, Pengdong, Xie, Senpei, Wang, Yong, Ye, Ziheng, Fu, Zhenbang, Wang, Qiyuan, Ma, Xing, Zhang, Jiaheng, He, Peng, Li, Kang, Zhao, Weiwei
Format: Article
Language:English
Subjects:
laser modification
low-temperature sintering
paper-based flexible printed electronics
silver nanoparticles
TiO
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Summary:Ultralow-temperature sintering plays a vital role in the development of flexible printed electronics, which improves flexibility and reduces energy consumption. This study investigates the ultralow-temperature sintering of large-sized silver nanoparticles (Ag NPs) by laser modification of the substrate surface. Ag NPs in conductive ink were sintered at only 60 °C. Designing the appropriate size of modified regions, the sintered Ag layer exhibits a sheet resistance of only 0.274 and withstands 10 000 folding cycles. Energy-dispersive x-ray spectroscopy showed that TiO2 formed by laser ablation promotes the sintering of Ag NPs and joining with the substrate. A paper-based flexible integrated circuit board was also prepared.
ISSN:0957-4484
1361-6528
DOI:10.1088/1361-6528/ab437a