Influence of transient enhanced diffusion of the intrinsic base dopant profile on SiGe HBT DC and HF characteristics

The influence of transient enhanced boron out-diffusion from the intrinsic base, caused by excess silicon interstitials created during the extrinsic base implantation, has been investigated for a non-selective SiGe HBT process. Devices with different designs of the extrinsic base region were fabrica...

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Bibliographic Details
Published in:Solid-state electronics 2000-10, Vol.44 (10), p.1747-1752
Main Authors: Malm, B.Gunnar, Grahn, Jan V, Östling, Mikael
Format: Article
Language:English
Subjects:
Base design
Device simulation
Ion-implantation
Silicon–Germanium HBT
Transient enhanced diffusion (TED)
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Summary:The influence of transient enhanced boron out-diffusion from the intrinsic base, caused by excess silicon interstitials created during the extrinsic base implantation, has been investigated for a non-selective SiGe HBT process. Devices with different designs of the extrinsic base region were fabricated, where some designs allowed part of the epitaxial base to be implanted with a high boron dose, hereby increasing the number of silicon interstitials close to the intrinsic device. These devices showed a marked degradation of DC characteristics and HF performance. 2D-device simulations were used to investigate the sensitivity in DC and HF parameters to vertical base profile changes. Good agreement was obtained between measured and simulated DC and HF characteristics.
ISSN:0038-1101
1879-2405
DOI:10.1016/S0038-1101(00)00130-1