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Dislocation Behavior in the Vicinity of Grain Boundaries in FCC Metals and Alloys

Dislocation behavior in the vicinity of grain boundaries has been investigated by in situ deformation with a 3 MV electron microscope in bicrystals of aluminum, copper and copper-aluminum alloys. Results obtained are summarized as follows: (a) The dislocations in a Cu-5 wt%Al alloy can move through...

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Bibliographic Details
Published in:Transactions of the Japan Institute of Metals 1983, Vol.24(4), pp.195-204
Main Authors: Fujita, Hiroshi, Toyoda, Katsuyuki, Mori, Takeshi, Tabata, Teiz\={o}, Ono, Tatuo, Takeda, Toshihide
Format: Article
Language:English
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Summary:Dislocation behavior in the vicinity of grain boundaries has been investigated by in situ deformation with a 3 MV electron microscope in bicrystals of aluminum, copper and copper-aluminum alloys. Results obtained are summarized as follows: (a) The dislocations in a Cu-5 wt%Al alloy can move through the boundary with misfit angle 5° at some parts where the dislocations pile up two-dimensionally when the tensile axis is perpendicular to the tilt boundary. (b) When the stacking fault energy and the misfit angle of boundary increase, the dislocations become hardly possible to move through the boundary. (c) Three-dimensional pile-up of the dislocations heavily occurs against the boundary in a crystal, whose Schmid factor is larger than the other, when the tensile axis is perpendicular to the boundary. The dislocation tangles, however, are formed in another crystal. (d) Many slip systems are operated in the vicinity of the boundary and the dislocation tangles are easily formed in both crystals when the tensile axis is parallel to the boundary. (e) Recrystallization easily occurs in regions near the boundary when the specimens is stretched along the boundary.
ISSN:0021-4434
2432-4701
DOI:10.2320/matertrans1960.24.195