Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry

The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented inform...

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Bibliographic Details
Published in:Analytical chemistry (Washington) 2020-01, Vol.92 (1), p.1355-1362
Main Authors: Cedeño López, A, Grimaudo, V, Riedo, A, Tulej, M, Wiesendanger, R, Lukmanov, R, Moreno-García, P, Lörtscher, E, Wurz, P, Broekmann, P
Format: Article
Language:English
Subjects:
Chemistry
Composition
Depth profiling
Ionization
Laser ablation
Mass spectrometry
Mass spectroscopy
Melting point
Melting points
Organic chemistry
Scientific imaging
Sensitivity analysis
Spectroscopy
Surface roughness
Three dimensional analysis
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Summary:The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented information on the distribution of individual elements inside the solder bump matrix. Moreover, the determination of matrix-matched relative sensitivity coefficients allows the first report on quantitative assessment of the SnAg alloy composition. These results significantly contribute to an in-depth understanding of the SnAg plating process. This experimental procedure may find application in future additive performance screening.
ISSN:0003-2700
1520-6882
DOI:10.1021/acs.analchem.9b04530