Loading…

Physical Supercritical Fluid Deposition: Patterning Solution Processable Materials on Curved and Flexible Surfaces

We provide the initial demonstration of a general thin film deposition technique that leverages the unique solubility properties of supercritical fluids. The technique is the solution-phase analogue of physical vapor deposition and allows thin films of a semiconducting polymer to be grown without th...

Full description

Saved in:
Bibliographic Details
Published in:ACS applied materials & interfaces 2020-04, Vol.12 (15), p.17949-17956
Main Authors: Yousefi, Nastaran, Maala, Janneus J, Louie, Mikayla, Storback, Jacob, Kaake, Loren G
Format: Article
Language:English
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:We provide the initial demonstration of a general thin film deposition technique that leverages the unique solubility properties of supercritical fluids. The technique is the solution-phase analogue of physical vapor deposition and allows thin films of a semiconducting polymer to be grown without the need for in situ chemical reactions. Film growth is approximately linear with time, indicating that film thickness can be controlled in a straightforward manner by varying the time of deposition. To further demonstrate the flexibility of the technique, we demonstrate precise control over the location of material deposition using a combination of photolithography and resistive heating. The potential for scalable manufacturing is demonstrated by use of a master to control deposition onto a flexible polymer film. Finally, we demonstrate a unique deposition capability of this technique by depositing patterns onto the curved interior of a hemisphere made from a silicone elastomer. This capability is not possible with any printing or line-of-sight deposition technique. More generally, the ability to control the deposition of solution processed materials with high accuracy provides the long sought after bridge between top-down and bottom-up self-assembly.
ISSN:1944-8244
1944-8252
DOI:10.1021/acsami.0c00724