Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates

Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1987-08, Vol.134 (8), p.1902-1905
Main Authors: HALL, L. C, MAJOR, C. P, STEPPAN, J. J, ROTH, J. A, VAUGHEN, B. K
Format: Article
Language:English
Subjects:
Applied sciences
Cleaning. Degreasing. Pickling
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Metals, semimetals and alloys
Metals. Metallurgy
Physics
Production techniques
Specific materials
Surface treatment
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Summary:Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water then isopropanol rinse and storage. Rapid, blank, electrical-short-times are found using the first two steps and long, blank-times for all steps. Cyclic voltammetry at high purity Cu electrodes over the range of --0.1 to --1.0 V vs. Ag/AgCl correlates cleaning procedure with the presence or absence of surface oxides and/or Cu ions. Good agreement was found between blank, accelerated test runs for metal migration devices and CV scans. A precise and reproducible method of characterizing the conditions of a metal surface after mechanical, chemical, and/or environmental treatment is provided by CV scans. 7 ref.--AA
ISSN:0013-4651
1945-7111
DOI:10.1149/1.2100786