Loading…

Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates

Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water...

Full description

Saved in:

Bibliographic Details
Published in:	Journal of the Electrochemical Society 1987-08, Vol.134 (8), p.1902-1905
Main Authors:	HALL, L. C, MAJOR, C. P, STEPPAN, J. J, ROTH, J. A, VAUGHEN, B. K
Format:	Article
Language:	English
Subjects:	Applied sciences Cleaning. Degreasing. Pickling Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Metals, semimetals and alloys Metals. Metallurgy Physics Production techniques Specific materials Surface treatment
Citations:	Items that cite this one
Online Access:	Get full text
Tags:	Add Tag No Tags, Be the first to tag this record!

cited_by	cdi_FETCH-LOGICAL-c314t-c941390907413c88cf3fa2968900c6c4ef0bae3be4898c31f20a717a2112013d3
cites
container_end_page	1905
container_issue	8
container_start_page	1902
container_title	Journal of the Electrochemical Society
container_volume	134
creator	HALL, L. C MAJOR, C. P STEPPAN, J. J ROTH, J. A VAUGHEN, B. K
description	Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water then isopropanol rinse and storage. Rapid, blank, electrical-short-times are found using the first two steps and long, blank-times for all steps. Cyclic voltammetry at high purity Cu electrodes over the range of --0.1 to --1.0 V vs. Ag/AgCl correlates cleaning procedure with the presence or absence of surface oxides and/or Cu ions. Good agreement was found between blank, accelerated test runs for metal migration devices and CV scans. A precise and reproducible method of characterizing the conditions of a metal surface after mechanical, chemical, and/or environmental treatment is provided by CV scans. 7 ref.--AA
doi_str_mv	10.1149/1.2100786
format	article
fullrecord	<record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_24407358</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>24407358</sourcerecordid><originalsourceid>FETCH-LOGICAL-c314t-c941390907413c88cf3fa2968900c6c4ef0bae3be4898c31f20a717a2112013d3</originalsourceid><addsrcrecordid>eNo9kE9LxDAQxYMouK4e_AY5iOCha6ZJm-Qoi_9gwYueSzadSCVtapIV9tubxcXT8Ib3e8w8Qq6BrQCEvodVDYxJ1Z6QBWjRVBIATsmCMeCVaBs4JxcpfRUJSsgF2a731g-W_gSfzThijkWkvOv3NDhqwzxjpOjR5hh6pHMsDjR5xClTFyIthPF0HD6jyUOYqJn6QsUY0kGVJaZLcuaMT3h1nEvy8fT4vn6pNm_Pr-uHTWU5iFxZLYBrppks0yplHXem1q3SjNnWCnRsa5BvUSitCuJqZiRIUwPU5bmeL8ntX-4cw_cOU-7GIVn03kwYdqmrhWCSN6oY7_6MtpyZIrpujsNo4r4D1h1a7KA7tli8N8dQk6zxLprJDukfkI1qGq34LwSFcbQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>24407358</pqid></control><display><type>article</type><title>Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates</title><source>Institute of Physics</source><creator>HALL, L. C ; MAJOR, C. P ; STEPPAN, J. J ; ROTH, J. A ; VAUGHEN, B. K</creator><creatorcontrib>HALL, L. C ; MAJOR, C. P ; STEPPAN, J. J ; ROTH, J. A ; VAUGHEN, B. K</creatorcontrib><description>Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water then isopropanol rinse and storage. Rapid, blank, electrical-short-times are found using the first two steps and long, blank-times for all steps. Cyclic voltammetry at high purity Cu electrodes over the range of --0.1 to --1.0 V vs. Ag/AgCl correlates cleaning procedure with the presence or absence of surface oxides and/or Cu ions. Good agreement was found between blank, accelerated test runs for metal migration devices and CV scans. A precise and reproducible method of characterizing the conditions of a metal surface after mechanical, chemical, and/or environmental treatment is provided by CV scans. 7 ref.--AA</description><identifier>ISSN: 0013-4651</identifier><identifier>EISSN: 1945-7111</identifier><identifier>DOI: 10.1149/1.2100786</identifier><identifier>CODEN: JESOAN</identifier><language>eng</language><publisher>Pennington, NJ: Electrochemical Society</publisher><subject>Applied sciences ; Cleaning. Degreasing. Pickling ; Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Materials science ; Metals, semimetals and alloys ; Metals. Metallurgy ; Physics ; Production techniques ; Specific materials ; Surface treatment</subject><ispartof>Journal of the Electrochemical Society, 1987-08, Vol.134 (8), p.1902-1905</ispartof><rights>1988 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c314t-c941390907413c88cf3fa2968900c6c4ef0bae3be4898c31f20a717a2112013d3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>309,310,314,780,784,789,790,23928,23929,25138,27922,27923</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=7585598$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>HALL, L. C</creatorcontrib><creatorcontrib>MAJOR, C. P</creatorcontrib><creatorcontrib>STEPPAN, J. J</creatorcontrib><creatorcontrib>ROTH, J. A</creatorcontrib><creatorcontrib>VAUGHEN, B. K</creatorcontrib><title>Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates</title><title>Journal of the Electrochemical Society</title><description>Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water then isopropanol rinse and storage. Rapid, blank, electrical-short-times are found using the first two steps and long, blank-times for all steps. Cyclic voltammetry at high purity Cu electrodes over the range of --0.1 to --1.0 V vs. Ag/AgCl correlates cleaning procedure with the presence or absence of surface oxides and/or Cu ions. Good agreement was found between blank, accelerated test runs for metal migration devices and CV scans. A precise and reproducible method of characterizing the conditions of a metal surface after mechanical, chemical, and/or environmental treatment is provided by CV scans. 7 ref.--AA</description><subject>Applied sciences</subject><subject>Cleaning. Degreasing. Pickling</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Metals, semimetals and alloys</subject><subject>Metals. Metallurgy</subject><subject>Physics</subject><subject>Production techniques</subject><subject>Specific materials</subject><subject>Surface treatment</subject><issn>0013-4651</issn><issn>1945-7111</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1987</creationdate><recordtype>article</recordtype><recordid>eNo9kE9LxDAQxYMouK4e_AY5iOCha6ZJm-Qoi_9gwYueSzadSCVtapIV9tubxcXT8Ib3e8w8Qq6BrQCEvodVDYxJ1Z6QBWjRVBIATsmCMeCVaBs4JxcpfRUJSsgF2a731g-W_gSfzThijkWkvOv3NDhqwzxjpOjR5hh6pHMsDjR5xClTFyIthPF0HD6jyUOYqJn6QsUY0kGVJaZLcuaMT3h1nEvy8fT4vn6pNm_Pr-uHTWU5iFxZLYBrppks0yplHXem1q3SjNnWCnRsa5BvUSitCuJqZiRIUwPU5bmeL8ntX-4cw_cOU-7GIVn03kwYdqmrhWCSN6oY7_6MtpyZIrpujsNo4r4D1h1a7KA7tli8N8dQk6zxLprJDukfkI1qGq34LwSFcbQ</recordid><startdate>19870801</startdate><enddate>19870801</enddate><creator>HALL, L. C</creator><creator>MAJOR, C. P</creator><creator>STEPPAN, J. J</creator><creator>ROTH, J. A</creator><creator>VAUGHEN, B. K</creator><general>Electrochemical Society</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>19870801</creationdate><title>Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates</title><author>HALL, L. C ; MAJOR, C. P ; STEPPAN, J. J ; ROTH, J. A ; VAUGHEN, B. K</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c314t-c941390907413c88cf3fa2968900c6c4ef0bae3be4898c31f20a717a2112013d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1987</creationdate><topic>Applied sciences</topic><topic>Cleaning. Degreasing. Pickling</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Metals, semimetals and alloys</topic><topic>Metals. Metallurgy</topic><topic>Physics</topic><topic>Production techniques</topic><topic>Specific materials</topic><topic>Surface treatment</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>HALL, L. C</creatorcontrib><creatorcontrib>MAJOR, C. P</creatorcontrib><creatorcontrib>STEPPAN, J. J</creatorcontrib><creatorcontrib>ROTH, J. A</creatorcontrib><creatorcontrib>VAUGHEN, B. K</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of the Electrochemical Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>HALL, L. C</au><au>MAJOR, C. P</au><au>STEPPAN, J. J</au><au>ROTH, J. A</au><au>VAUGHEN, B. K</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates</atitle><jtitle>Journal of the Electrochemical Society</jtitle><date>1987-08-01</date><risdate>1987</risdate><volume>134</volume><issue>8</issue><spage>1902</spage><epage>1905</epage><pages>1902-1905</pages><issn>0013-4651</issn><eissn>1945-7111</eissn><coden>JESOAN</coden><abstract>Lithographic techniques for microcircuitry leave photoresist materials on Cu surfaces which must be removed to obtain reproducible metal migration rates. Reproducible results are obtained after these cleaning steps: (i) 25% HNO sub 3 (30 deg C), (ii) water rinse, (iii) 25% HCl (30 deg C), (iv) water then isopropanol rinse and storage. Rapid, blank, electrical-short-times are found using the first two steps and long, blank-times for all steps. Cyclic voltammetry at high purity Cu electrodes over the range of --0.1 to --1.0 V vs. Ag/AgCl correlates cleaning procedure with the presence or absence of surface oxides and/or Cu ions. Good agreement was found between blank, accelerated test runs for metal migration devices and CV scans. A precise and reproducible method of characterizing the conditions of a metal surface after mechanical, chemical, and/or environmental treatment is provided by CV scans. 7 ref.--AA</abstract><cop>Pennington, NJ</cop><pub>Electrochemical Society</pub><doi>10.1149/1.2100786</doi><tpages>4</tpages></addata></record>
fulltext	fulltext
identifier	ISSN: 0013-4651
ispartof	Journal of the Electrochemical Society, 1987-08, Vol.134 (8), p.1902-1905
issn	0013-4651 1945-7111
language	eng
recordid	cdi_proquest_miscellaneous_24407358
source	Institute of Physics
subjects	Applied sciences Cleaning. Degreasing. Pickling Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Metals, semimetals and alloys Metals. Metallurgy Physics Production techniques Specific materials Surface treatment
title	Cyclic voltammetric study of copper electrode pretreatment for metal migration and corrosion rates
url	http://sfxeu10.hosted.exlibrisgroup.com/loughborough?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-14T01%3A02%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Cyclic%20voltammetric%20study%20of%20copper%20electrode%20pretreatment%20for%20metal%20migration%20and%20corrosion%20rates&rft.jtitle=Journal%20of%20the%20Electrochemical%20Society&rft.au=HALL,%20L.%20C&rft.date=1987-08-01&rft.volume=134&rft.issue=8&rft.spage=1902&rft.epage=1905&rft.pages=1902-1905&rft.issn=0013-4651&rft.eissn=1945-7111&rft.coden=JESOAN&rft_id=info:doi/10.1149/1.2100786&rft_dat=%3Cproquest_cross%3E24407358%3C/proquest_cross%3E%3Cgrp_id%3Ecdi_FETCH-LOGICAL-c314t-c941390907413c88cf3fa2968900c6c4ef0bae3be4898c31f20a717a2112013d3%3C/grp_id%3E%3Coa%3E%3C/oa%3E%3Curl%3E%3C/url%3E&rft_id=info:oai/&rft_pqid=24407358&rft_id=info:pmid/&rfr_iscdi=true