Cyclic pulse voltammetric stripping analysis of acid copper plating baths

A pulse voltammetric stripping method is described for determining the absolute concentration of proprietary additive in acid Cu baths containing contaminants derived from circuit board plating. Results are presented for both freshly prepared and production baths, and a comparison is made between th...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1985-04, Vol.132 (4), p.831-834
Main Authors: TENCH, D, WHITE, J
Format: Article
Language:English
Subjects:
Applied sciences
Chemical and electrochemical properties
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Metals, semimetals and alloys
Metals. Metallurgy
Physics
Specific materials
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Description
Summary:A pulse voltammetric stripping method is described for determining the absolute concentration of proprietary additive in acid Cu baths containing contaminants derived from circuit board plating. Results are presented for both freshly prepared and production baths, and a comparison is made between the pulse and linear sweep voltammetric stripping analysis techniques. 6 ref.--AA
ISSN:0013-4651
1945-7111
DOI:10.1149/1.2113967