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Physical Properties of High-Pressure Plasmas of Hydrogen and Copper in the Temperature Range 5000-60 000 K
Material functions (density, specific heat, enthalpy, sonic velocity, viscosity, and thermal and electrical conductivities) of hydrogen and copper plasmas have been calculated for temperatures ranging from 5000 to 60 000 K and for pressures ranging from 1 to 104 atm (1 atm = 101.3 kPa). The equilibr...
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Published in: | IEEE transactions on plasma science 1985-01, Vol.13 (6), p.587-594 |
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container_title | IEEE transactions on plasma science |
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creator | Kovitya, P. |
description | Material functions (density, specific heat, enthalpy, sonic velocity, viscosity, and thermal and electrical conductivities) of hydrogen and copper plasmas have been calculated for temperatures ranging from 5000 to 60 000 K and for pressures ranging from 1 to 104 atm (1 atm = 101.3 kPa). The equilibrium concentrations of various species are obtained using the method of minimization of Gibbs free energy, with Debye-Hückel corrections applied to the free energies of ionized species. Transport properties have been calculated using the Chapman-Enskog method. |
doi_str_mv | 10.1109/TPS.1985.4316478 |
format | article |
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The equilibrium concentrations of various species are obtained using the method of minimization of Gibbs free energy, with Debye-Hückel corrections applied to the free energies of ionized species. Transport properties have been calculated using the Chapman-Enskog method.</description><identifier>ISSN: 0093-3813</identifier><identifier>EISSN: 1939-9375</identifier><identifier>DOI: 10.1109/TPS.1985.4316478</identifier><identifier>CODEN: ITPSBD</identifier><language>eng</language><publisher>IEEE</publisher><subject>Conducting materials ; Copper ; Hydrogen ; Plasma density ; Plasma materials processing ; Plasma properties ; Plasma temperature ; Resistance heating ; Temperature distribution ; Thermal conductivity</subject><ispartof>IEEE transactions on plasma science, 1985-01, Vol.13 (6), p.587-594</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c292t-2a827732bde123cc80930bc2f90089957aa3f8becabddd1d925430d62dfa5f123</citedby><cites>FETCH-LOGICAL-c292t-2a827732bde123cc80930bc2f90089957aa3f8becabddd1d925430d62dfa5f123</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/4316478$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,27901,27902,54771</link.rule.ids></links><search><creatorcontrib>Kovitya, P.</creatorcontrib><title>Physical Properties of High-Pressure Plasmas of Hydrogen and Copper in the Temperature Range 5000-60 000 K</title><title>IEEE transactions on plasma science</title><addtitle>TPS</addtitle><description>Material functions (density, specific heat, enthalpy, sonic velocity, viscosity, and thermal and electrical conductivities) of hydrogen and copper plasmas have been calculated for temperatures ranging from 5000 to 60 000 K and for pressures ranging from 1 to 104 atm (1 atm = 101.3 kPa). The equilibrium concentrations of various species are obtained using the method of minimization of Gibbs free energy, with Debye-Hückel corrections applied to the free energies of ionized species. Transport properties have been calculated using the Chapman-Enskog method.</description><subject>Conducting materials</subject><subject>Copper</subject><subject>Hydrogen</subject><subject>Plasma density</subject><subject>Plasma materials processing</subject><subject>Plasma properties</subject><subject>Plasma temperature</subject><subject>Resistance heating</subject><subject>Temperature distribution</subject><subject>Thermal conductivity</subject><issn>0093-3813</issn><issn>1939-9375</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1985</creationdate><recordtype>article</recordtype><recordid>eNo9kD1PwzAQhi0EEuVjR2LxxJZytuMkHlEFFFGJCMpsOfGlTZUv7HTov8dVCtOr073P6fQQcsdgzhiox3X-NWcqk_NYsCROszMyY0qoSIlUnpMZgBKRyJi4JFfe7wBYLIHPyC7fHnxdmobmrh_QjTV62ld0WW-2Ue7Q-71DmjfGt2ZaHKzrN9hR01m66IfA0Lqj4xbpGtswmfFIfJpug1QCQJQADUHfb8hFZRqPt6e8Jt8vz-vFMlp9vL4tnlZRyRUfI24ynqaCFxYZF2WZhc-hKHmlADKlZGqMqLICS1NYa5lVXMYCbMJtZWQVkGvyMN0dXP-zRz_qtvYlNo3psN97zeOUJUomoQhTsXS99w4rPbi6Ne6gGeijVB2k6qNUfZIakPsJqRHxv_63_QW5DXG-</recordid><startdate>19850101</startdate><enddate>19850101</enddate><creator>Kovitya, P.</creator><general>IEEE</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>19850101</creationdate><title>Physical Properties of High-Pressure Plasmas of Hydrogen and Copper in the Temperature Range 5000-60 000 K</title><author>Kovitya, P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c292t-2a827732bde123cc80930bc2f90089957aa3f8becabddd1d925430d62dfa5f123</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1985</creationdate><topic>Conducting materials</topic><topic>Copper</topic><topic>Hydrogen</topic><topic>Plasma density</topic><topic>Plasma materials processing</topic><topic>Plasma properties</topic><topic>Plasma temperature</topic><topic>Resistance heating</topic><topic>Temperature distribution</topic><topic>Thermal conductivity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Kovitya, P.</creatorcontrib><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on plasma science</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Kovitya, P.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Physical Properties of High-Pressure Plasmas of Hydrogen and Copper in the Temperature Range 5000-60 000 K</atitle><jtitle>IEEE transactions on plasma science</jtitle><stitle>TPS</stitle><date>1985-01-01</date><risdate>1985</risdate><volume>13</volume><issue>6</issue><spage>587</spage><epage>594</epage><pages>587-594</pages><issn>0093-3813</issn><eissn>1939-9375</eissn><coden>ITPSBD</coden><abstract>Material functions (density, specific heat, enthalpy, sonic velocity, viscosity, and thermal and electrical conductivities) of hydrogen and copper plasmas have been calculated for temperatures ranging from 5000 to 60 000 K and for pressures ranging from 1 to 104 atm (1 atm = 101.3 kPa). The equilibrium concentrations of various species are obtained using the method of minimization of Gibbs free energy, with Debye-Hückel corrections applied to the free energies of ionized species. Transport properties have been calculated using the Chapman-Enskog method.</abstract><pub>IEEE</pub><doi>10.1109/TPS.1985.4316478</doi><tpages>8</tpages></addata></record> |
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ispartof | IEEE transactions on plasma science, 1985-01, Vol.13 (6), p.587-594 |
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language | eng |
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source | IEEE Electronic Library (IEL) Journals |
subjects | Conducting materials Copper Hydrogen Plasma density Plasma materials processing Plasma properties Plasma temperature Resistance heating Temperature distribution Thermal conductivity |
title | Physical Properties of High-Pressure Plasmas of Hydrogen and Copper in the Temperature Range 5000-60 000 K |
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