Tensile behavior of Pb-Sn solder/Cu joints

Solders of nominal 95Pb--5Sn and 60Sn--40Pb were used to join Cu plates. The effect of ternary additions of indium, Ag, Sb, and bismuth to the near-eutectic solder were also investigated. Bulk solder and interfacial joint microstructures were characterized for each solder alloy. The solder joints we...

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Bibliographic Details
Published in:Journal of electronic materials 1987-05, Vol.16 (3), p.203-208
Main Authors: QUAN, L, FREAR, D, GRIVAS, D, MORRIS, J. W. JR
Format: Article
Language:English
Subjects:
Applied sciences
Brazing. Soldering
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Materials science
Metals, semimetals and alloys
Metals. Metallurgy
Physics
Specific materials
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Summary:Solders of nominal 95Pb--5Sn and 60Sn--40Pb were used to join Cu plates. The effect of ternary additions of indium, Ag, Sb, and bismuth to the near-eutectic solder were also investigated. Bulk solder and interfacial joint microstructures were characterized for each solder alloy. The solder joints were strained to failure in tension; joint strength and failure mode were determined. 95Pb--5Sn/Cu and 60Sn--40Pb/Cu specimens were tested both as-processed and after reflow. 95Pb--5Sn/Cu as-processed and reflow specimens failed in tension in a ductile mode. Voids initiated at beta -Sn precipitates in the as-processed specimens and at the Cu sub 3 Sn intermetallic in both the reflow specimens. 60Sn--40Pb/Cu failed transgranularly through the Cu sub 6 Sn sub 5 intermetallic in both the as-processed and reflow conditions. The joint tensile strength of the reflow specimens was approximately half that of the as-processed specimens for both the high-Pb and near-eutectic alloys. The Cu sub 6 Sn sub 5 intermetallic dominated the tensile failure mode of the near-eutectic solder/Cu joints. The fracture path of the near-eutectic alloys with ternary additions depended on the presence of Cu sub 6 Sn sub 5 rods in the solder within the Cu plates. Specimens with ternary additions of In and Ag contained only interfacial intermetallics and exhibited interfacial failure at the Cu sub 6 Sn sub 5 . Joints manufactured with ternary additions of Sb and Bi contained rods of Cu sub 6 Sn sub 5 within the solder. Tensile failure of the Sb and Bi specimens occurred through the solder at the Cu sub 6 Sn sub 5 rods. 7 ref.--AA
ISSN:0361-5235
1543-186X
DOI:10.1007/BF02655488