Evolution of hole size and shape in {100}, {110} and {111} monocrystalline thin films of gold

• Published in: Thin solid films 1987-07, Vol.150 (2), p.323-335
• Main Authors: Lanxner, M., Bauer, C.L., Scholz, R.
• Format: Article
• Language: English
• Subjects: Condensed matter: structure, mechanical and thermal properties; Cross-disciplinary physics: materials science; rheology; Exact sciences and technology; Materials science; Metals, semimetals and alloys; Physics; Specific materials; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties); Thin film structure and morphology
• ISSN: 0040-6090; 1879-2731
• DOI: 10.1016/0040-6090(87)90105-2

Monocrystalline thin films of gold, containing controlled distributions of small holes, were produced by an epitaxial flash deposition process on heated {100}, {110} and {111} monocrystalline substrates of sodium chloride. These films, ranging from 10 to 20 nm in thickness, were then removed from their substrates, annealed for various periods at temperatures ranging from 180 to 290 °C and subsequently examined by transmission electron microscopy in order to record the evolution of hole size and shape as a function of crystallographic orientation and annealing conditions. During annealing, these holes either grow or shrink, depending on the ratio of hole diameter to film thickness, with growing holes developing clearly defined crystallographic facets aligned normal to the film surface. The evolution of hole size is in satisfactory agreement with a kinetic analysis based on atomic surface mobility, whereas the evolution of hole shape is consistent with anisotropy of the surface energy, as computed from a nearest neighbor bond model.