Slow (subcritical) crack growth in electrical ceramics

The double-torque (twist) method was used to determine the subcritical crack growth of various electrical porcelains. The method of visual inspection was modified. The various parameters used in the equation for describing subcritical crack growth were derived for the following porcelains: mullite,...

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Bibliographic Details
Published in:Glass and ceramics 1988-09, Vol.45 (9), p.336-338
Main Authors: Karpilovskii, L P, Beshentsev, V D, Palchaev, D K, Pashuk, E G
Format: Article
Language:English
Online Access:Get full text
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Summary:The double-torque (twist) method was used to determine the subcritical crack growth of various electrical porcelains. The method of visual inspection was modified. The various parameters used in the equation for describing subcritical crack growth were derived for the following porcelains: mullite, quartz-feldspar, alumina, and high-alumina. The stress intensity factor, KIC, for mullite porcelain is relatively low. Experiments were carried out which confirmed the assumption that the high sensitivity of mullite porcelain was due to the presence of macrodefects. 3 refs.
ISSN:0361-7610
1573-8515
DOI:10.1007/BF00677486