Improved Properties of the Atomic Layer Deposited Ru Electrode for Dynamic Random-Access Memory Capacitor Using Discrete Feeding Method

• Published in: ACS applied materials & interfaces 2021-05, Vol.13 (20), p.23915-23927
• Main Authors: Kwon, Dae Seon, Jeon, Woojin, Kim, Dong Gun, Kim, Tae Kyun, Seo, Haengha, Lim, Junil, Hwang, Cheol Seong
• Format: Article
• Language: English
• Subjects: Functional Inorganic Materials and Devices
• ISSN: 1944-8244; 1944-8252
• DOI: 10.1021/acsami.1c03795

Ruthenium (Ru) thin films deposited via atomic layer deposition (ALD) with a normal sequence and discrete feeding method (DFM) and their performance as a bottom electrode of dynamic random-access memory (DRAM) capacitors were compared. The DFM-ALD was performed by dividing the Ru feeding and purge steps of the conventional ALD process into four steps (shorter feeding time + purge time). The surface morphology of the Ru films was improved significantly with the DFM-ALD, and the preferred orientation of the Ru films was changed from relatively random to a -oriented direction. Under the DFM-ALD condition, the higher susceptibility of oxygen atoms to the Ru electrode resulted in a higher proportion of the RuO2 formation on the Ru film surface during the subsequent TiO2 ALD process. This higher RuO2 portion leads to higher crystallinity of the local-epitaxially grown TiO2 films with a rutile phase. Such improvement also decreased the interfacial component of equivalent oxide thickness (EOTi) by ∼0.1 nm compared with the cases on sputtered Ru film, which showed an even smoother surface morphology. Consequently, the minimum EOT values when the Ru bottom electrodes deposited via DFM-ALD were adopted were 0.76 and 0.48 nm for TiO2 and Al-doped TiO2 films, respectively, while still satisfying the DRAM leakage current density specification (