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Improvements in aluminum adhesion and breakdown voltages of polyvinylidene fluoride films following exposure to gas plasmas
Changes in water wettability, improvement in adhesion of vapor deposited aluminum and increases in dielectric breakdown voltage in thin, 12 micron PVDF films were observed following brief exposure of these films to low‐temperature gas plasmas.
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Published in: | Polymers for advanced technologies 1991-08, Vol.2 (4), p.209-210 |
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Main Authors: | , , |
Format: | Article |
Language: | English |
Citations: | Items that this one cites Items that cite this one |
Online Access: | Get full text |
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Summary: | Changes in water wettability, improvement in adhesion of vapor deposited aluminum and increases in dielectric breakdown voltage in thin, 12 micron PVDF films were observed following brief exposure of these films to low‐temperature gas plasmas. |
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ISSN: | 1042-7147 1099-1581 |
DOI: | 10.1002/pat.1991.220020407 |