Scanning electron microscopy and electron microprobe analysis of Au-GeOx-Cu and Au-AlOx-Cu sandwich structures

Direct observations of the counter-electrode surface of electroformed Au-l-Cu sandwich structures (where l is reactively evaporated AlOx or GeOx) were carried out using scanning electron microscopy. Electron microprobe analyses of surface defects in electroformed samples, after etching the copper co...

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Bibliographic Details
Published in:Journal of materials science 1991-05, Vol.26 (9), p.2431-2435
Main Authors: EL-SAMANOUDY, M. M, BEYNON, J
Format: Article
Language:English
Subjects:
Condensed matter: structure, mechanical and thermal properties
Exact sciences and technology
Physics
Solid surfaces and solid-solid interfaces
Surface and interface dynamics and vibrations
Surfaces and interfaces
thin films and whiskers (structure and nonelectronic properties)
Thin film structure and morphology
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Summary:Direct observations of the counter-electrode surface of electroformed Au-l-Cu sandwich structures (where l is reactively evaporated AlOx or GeOx) were carried out using scanning electron microscopy. Electron microprobe analyses of surface defects in electroformed samples, after etching the copper counter-electrode, tended to confirm the presence of copper. Surface defects are identified as the terminations of filament bundles, which supports the filamentary model of conduction. 19 refs.
ISSN:0022-2461
1573-4803
DOI:10.1007/BF01130191