Study of copper-alumina bonding

Bonding between copper and alumina can be obtained by 'solid state bonding' and 'liquid phase bonding'. The strength of interfaces was tested mechanically using shear tests, tensile tests and fracture toughness tests. The effects of bonding parameters on bond strength were studie...

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Bibliographic Details
Published in:Journal of materials science 1989-12, Vol.24 (12), p.4545-4554
Main Authors: BERAUD, C, COURBIERE, M, ESNOUF, C, JUVE, D, TREHEUX, D
Format: Article
Language:English
Subjects:
Adhesive bonding
Applied sciences
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Joining, thermal cutting: metallurgical aspects
Materials science
Metals, semimetals and alloys
Metals. Metallurgy
Physics
Specific materials
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Summary:Bonding between copper and alumina can be obtained by 'solid state bonding' and 'liquid phase bonding'. The strength of interfaces was tested mechanically using shear tests, tensile tests and fracture toughness tests. The effects of bonding parameters on bond strength were studied. Observations by TEM detected and analysed the nature and evolution of interfacial compounds as a function of copper oxidation and bonding time. Chemical reactions lead to the formation of CuAlO2. The stability of this compound and the reversibility of chemical reactions appear to very dependent on the amount of oxygen in the system. 29 refs.
ISSN:0022-2461
1573-4803
DOI:10.1007/BF00544543