Tensile properties of nanostructured Ni-Cu multilayered materials prepared by electrodeposition

As the layer thickness in 90 percent Ni-10 percent Cu multilayered alloys electrodeposited from a sulfamate bath are decreased, the ultimate tensile strength peaks at 1100 MPa for 6-7 nm Cu layers, and then decreases to about 1000 MPa as the Cu layer thickness reaches 1 nm. This decrease in deposit...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1991-12, Vol.138 (12), p.3757-3758
Main Authors: TENCH, D. M, WHITE, J. T
Format: Article
Language:English
Subjects:
Chemistry
Electrochemistry
Exact sciences and technology
General and physical chemistry
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Summary:As the layer thickness in 90 percent Ni-10 percent Cu multilayered alloys electrodeposited from a sulfamate bath are decreased, the ultimate tensile strength peaks at 1100 MPa for 6-7 nm Cu layers, and then decreases to about 1000 MPa as the Cu layer thickness reaches 1 nm. This decrease in deposit strength is associated with a reduction in the (100) texture caused by the influence of Cu, which has a (110) preferred orientation in the sulfamate system. The result suggests that highly coherent nanostructured multilayers can only be deposited from a single electrolyte if the preferred orientation for the two metals in the same.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.2085495