Reliability evaluation of high pin count hermetic ceramic IC packages for space applications

The results to date of a reliability testing program for the European Space Agency on high-pin-count hermetic ceramic packages are presented. The objectives of the program, which commenced in 1988, are discussed. Results are presented from work on: application of scanning acoustic microscopy (SAM) t...

Full description

Saved in:
Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1992-12, Vol.15 (6), p.1093-1104
Main Authors: Barrett, J.J., Hayes, T.F., Doyle, R., Mathuna, S.C.O., Yamada, T., Boetti, A.
Format: Article
Language:English
Subjects:
Acoustic measurements
Acoustic testing
Applied sciences
Ceramics
Circuit testing
Electric variables measurement
Electrical resistance measurement
Electronics
Exact sciences and technology
Impedance measurement
Microscopic examination
Packaging
Printed circuit boards
Reliability
Soldering
Space applications
Surface mount technology
System testing
Testing
Testing, measurement, noise and reliability
Thermal resistance
Citations: Items that this one cites
Items that cite this one
Online Access:Get full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The results to date of a reliability testing program for the European Space Agency on high-pin-count hermetic ceramic packages are presented. The objectives of the program, which commenced in 1988, are discussed. Results are presented from work on: application of scanning acoustic microscopy (SAM) to die attach and lid seal quality assessment; the use of thermal characterization test chips and a computer controlled thermal resistance measurement system to measure thermal impedances of ceramic quad flat pack (CQFP) and ceramic pin grid array (CPGA) packages; numerical prediction and practical measurement of electrical parasitics of CQFP and CPGA packages; quality and reliability testing of CQPF and CPGA packages; and quality and reliability testing of 20- and 25-mil pitch surface-mount solder assemblies of high-pin-count CQFP packages assembled on printed circuit boards.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.206936