Loading…

Packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic modules

The authors describe a packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic (OE) modules. They use a special OE component-to-singlemode fiber (SMF) coupling arrangement showing up 92% coupling efficiency. In order to attach the fiber to the device and to insure the...

Full description

Saved in:
Bibliographic Details
Main Authors: Kalonji, N., Semo, J., Tannion, J., Foucher, M.
Format: Conference Proceeding
Language:English
Subjects:
Online Access:Request full text
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Summary:The authors describe a packaging technology for wide bandwidth, high optical coupling pigtailed optoelectronic (OE) modules. They use a special OE component-to-singlemode fiber (SMF) coupling arrangement showing up 92% coupling efficiency. In order to attach the fiber to the device and to insure the stability of the alignment, YAG laser welding technique is used. This yields to packaging excess losses ranging from 0.3 to 1 dB. Furthermore, a special device holder has been developed to allow very high speed devices, easy and effective link between several devices.
ISSN:0569-5503
DOI:10.1109/ECTC.1995.517774