Blocking inhibitors in cathodic Leveling. I. Theoretical analysis

A model for predicting leveling during electrodeposition in the presence of an inhibiting additive is presented. Based on a diffusion-adsorption mechanism, the model assumes that the additive is consumed at the cathode by electroreduction. Using the approximation of a flat, stagnant diffusion layer,...

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Bibliographic Details
Published in:Journal of the Electrochemical Society 1996-12, Vol.143 (12), p.3927-3936
Main Authors: MADORE, C, MATLOSZ, M, LANDOLT, D
Format: Article
Language:English
Subjects:
Chemistry
Electrochemistry
Electrodeposition
Exact sciences and technology
General and physical chemistry
Study of interfaces
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Summary:A model for predicting leveling during electrodeposition in the presence of an inhibiting additive is presented. Based on a diffusion-adsorption mechanism, the model assumes that the additive is consumed at the cathode by electroreduction. Using the approximation of a flat, stagnant diffusion layer, leveling during metal electrodeposition into triangular and semicircular grooves is simulated. The variation of the leveling agent concentration along the groove profile is determined by solving a concentration field problem with a boundary element method, and the advancement of the groove profile is simulated with a flexible moving-boundary algorithm. Leveling performance depends on three dimensionless groups characterizing leveling-agent reduction, metal-ion reduction, and the geometrical ratio of the diffusion layer thickness to groove depth. Experiments (done in part II of this study) were done with nickel deposition.
ISSN:0013-4651
1945-7111
DOI:10.1149/1.1837318