Packaging a 150-W bipolar ECL microprocessor

Recent developments in computer-aided design (CAD) have made highly automated layout of custom emitter coupled logic (ECL) circuits possible. These layouts have a much higher circuit and power density than gate array designs. It is now possible to place an entire ECL microprocessor, including floati...

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Bibliographic Details
Published in:IEEE transactions on components, hybrids, and manufacturing technology hybrids, and manufacturing technology, 1993-02, Vol.16 (1), p.28-38
Main Authors: Hamburgen, W.R., Fitch, J.S.
Format: Article
Language:English
Subjects:
Applied sciences
Cache memory
Circuit testing
Coupling circuits
Current supplies
Design automation
Electronics
Electronics packaging
Exact sciences and technology
Integrated circuits
Integrated circuits by function (including memories and processors)
Logic circuits
Logic design
Microprocessors
Plastic packaging
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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Summary:Recent developments in computer-aided design (CAD) have made highly automated layout of custom emitter coupled logic (ECL) circuits possible. These layouts have a much higher circuit and power density than gate array designs. It is now possible to place an entire ECL microprocessor, including floating point unit and cache memory, on one large die. To demonstrate the capability of supporting such a die, low-cost air-cooled single-chip packaging was built and tested for a 12.6-mm by 15.4-mm die. The plastic pin grid array (PPGA) package supplied the required current and maintained junction temperatures at less than 100 degrees C while dissipating 150 W. This required innovation in five areas: die metalization, bondwire layout, PPGA package design, die attach, and cooling by a thermosiphon.< >
ISSN:0148-6411
1558-3082
DOI:10.1109/33.214857